SMD placement
For LP transport throughout the entire SMD process, we produce product-specific recordings for a wide variety of printed circuit boards
mountings for Flex- and rigid-Flex-LP
Especially in the area of flex and rigid-flex LPs, the use layouts often do not permit direct transport. In such cases, our mounts are used.
Supports for solder paste printing
To ensure optimal solder paste application and to eliminate component hazards, we produce product-specific supports for solder paste printing on the second side. We manufacture this ESD grade glass fibre composite or aluminium.
Advantages:
- Higher process safety
- No contact with SMD components
- Short set-up times